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Processor manufacturer Intel |
Processor family Intel® Xeon® |
Processor generation 1st Generation Intel® Xeon® Scalable |
Processor model 4110 |
Processor frequency 2.1 GHz |
Processor boost frequency 3 GHz |
Processor cores 8 |
Processor cache 11 MB |
Memory channels supported by processor Hepta |
Number of processors installed 1 |
Thermal Design Power (TDP) 85 W |
Processor cache type L3 |
Processor socket LGA 3647 (Socket P) |
Processor lithography 14 nm |
Processor threads 16 |
Processor operating modes 64-bit |
Processor codename Skylake |
Tcase 77 °C |
Maximum internal memory supported by processor 768 GB |
Memory types supported by processor LPDDR4-SDRAM |
Memory clock speeds supported by processor 2400 MHz |
ECC supported by processor |
Execute Disable Bit |
Maximum number of PCI Express lanes 48 |
Processor package size 76.0 x 56.5 mm |
Supported instruction sets AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability 2S |
Embedded options available |
Conflict-Free processor |
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Internal memory 16 GB |
Internal memory type DDR4-SDRAM |
Memory slots 12 |
Memory clock speed 2666 MHz |
Memory layout (slots x size) 1 x 16 GB |
Maximum internal memory 768 GB |
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Maximum storage capacity 61.44 TB |
Total storage capacity 600 GB |
Number of HDDs installed 2 |
HDD capacity 300 GB |
HDD interface Serial ATA, Serial Attached SCSI (SAS) |
HDD speed 10000 RPM |
HDD size 2.5" |
Supported HDD sizes 2.5,3.5" |
RAID support |
RAID levels 0, 1, 5, 6, 10, 50, 60 |
Supported RAID controllers 930-8i |
Hot-Plug support |
Hot-swap |
Optical drive type DVD±RW |
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On-board graphics card |
On-board graphics card model Matrox G200 |
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Ethernet LAN |
Cabling technology 10/100/1000Base-T(X) |
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USB 2.0 ports quantity 3 |
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 3 |
VGA (D-Sub) ports quantity 1 |
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PCI Express x8 (Gen 3.x) slots 2 |
PCI Express x16 (Gen 3.x) slots 2 |
PCI Express slots version 3.0 |
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Chassis type Tower |
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Performance management XClarity Standard |
Trusted Platform Module (TPM) |
Trusted Platform Module (TPM) version 1.2 |
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Compatible operating systems Microsoft Windows Server 2016/2012 R2, Red Hat Enterprise Linux 7.3/6.9, SUSE, Linux Enterprise Server 12 SP2/11 SP4, VMware vSphere (ESXi) 6.5/6.0 U3 |
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Enhanced Intel SpeedStep Technology |
Intel Virtualization Technology for Directed I/O (VT-d) |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Intel® Turbo Boost Technology 2.0 |
Intel® AES New Instructions (Intel® AES-NI) |
Intel Trusted Execution Technology |
Intel VT-x with Extended Page Tables (EPT) |
Intel TSX-NI |
Intel 64 |
Intel Virtualization Technology (VT-x) |
Intel TSX-NI version 1.00 |
Processor ARK ID 123547 |
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Redundant power supply (RPS) support |
Power supply 550 W |
Number of main power supplies 2 |
Power supply input frequency 50 - 60 Hz |
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Operating temperature (T-T) 10 - 35 °C |
Storage temperature (T-T) -10 - 60 °C |
Operating relative humidity (H-H) 20 - 80% |
Storage relative humidity (H-H) 8 - 90% |
Operating altitude 0 - 3048 m |
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Sustainability certificates ENERGY STAR |
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Width 175.8 mm |
Depth 666.4 mm |
Height 425.5 mm |
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Flash memory 2048 MB |